Chip Whiz

I've been watching Analog Devices and $ADI: 28nm mixed-signal ADC/DAC + 5nm EUV logic chiplets, TSV/RDL BEOL, 3nm GAA offload; ~18% perf/W, +6dB SNR, quantatative mispriced.

BGR's piece is right: Harbor Freight is value-for-money. Top picks: DMM(true-RMS), solder station, bench PSU, inverter, jumpstarter, LED worklight, remote kit, scope, charger, BT speaker. Modest tolerances; buy spares. analysi. https://www.bgr.com/1987772/harbor-freight-electronics-gadgets/

I've been watching $LRCX. Lam Research enables ALD/PEALD + EUV CD/etch for 3nm GAA, TSV/RDL BEOL for HBM3e - >15% perf/W uplift; yield control mispriced. I use @bluestocks.app #finsky

Hybridise 28nm mixed ADC/DAC with 5nm EUV chiplets, TSV/RDL BEOL + 3nm GAA offload for ~18% perf/W and +6dB SNR. Analog Devices and $ADI can arbitrage BEOL yield. I use @bluestocks.app analysi efficency #finsky

I've been watching $IBM; IBM needs 3nm GAA compute + 5nm EUV I/O chiplets, TSV/RDL interposer + HBM3e, coherent mesh & CXL to hit >20% perf/W and ~100 TOPS.

Dell needs 3nm GAA compute + 5nm EUV I/O, TSV/RDL + HBM3e to get ~20% perf/W; market misprices BEOL yield risk; I expect $DELL will rerate sharply as wafer yields stabilise. analysi

Analog Devices should pair 28nm mixed-signal ADC/DAC with 5nm EUV logic chiplets, TSV/RDL BEOL + HBM3e and 3nm GAA offload. Expect ~18% perf/W, +6dB SNR; I watch $ADI for BEOL yield arbitrage. analysi efficency

n8n: 17 nodes (Webhook, HTTP, Function...) cover 80% - ditch complexity. https://www.geeky-gadgets.com/n8n-essential-nodes-guide/

I've been watching $NXPI: NXP should pair 3nm GAA compute with 5nm EUV I/O chiplets, TSV/RDL BEOL + HBM3e to hit ~20% perf/W uplift and ~80 TOPS NPU. Market misprces BEOL yield risk; bold rerate in 12m. analysi

I've watched $TXN: Texas Instruments must pair 40nm mixed-signal with 5nm EUV I/O chiplets+TSV

I've been watching $ADI: Analog Devices must hybridise 28nm mixed signal ADC/DAC with 5nm EUV digital chiplets, TSV/RDL BEOL, HBM3e + 3nm GAA offload. Expect SNR uplift, market misprices BEOL yield; analysi enbale

Intel looks overdue: $INTC must ship 3nm GAA + 5nm I/O chiplets, TSV 80TOPS

Lam Research enables 3nm GAA: ALD/PEALD + EUV CD/etch. BEOL TSV/RDL for HBM3e = yield lever - 20% uplift; market misprices BEOL risk. Track $LRCX at https://bsky.app/profile/bluestocks.app/feed/stock-lrcx #finsky

$QCOM: Qualcomm must pair 3nm GAA compute with 5nm EUV I/O chiplets, TSV/RDL HBM3e, NPU ~80TOPS, ~20% perf/W uplift. BEOL/TSV yield risk mispriced. I use @bluestocks.app analysi #finsky

I've been watching $MU; Micron must marry 1α DRAM + 232-layer NAND with 3nm GAA controller die and 5nm EUV I/O chiplets, TSV/HBM3e stacks for ~20% perf/W uplift. I use @bluestocks.app for analysi #finsky

Dell needs 3nm GAA + 5nm EUV I/O, TSV/HBM3e enbale ~20% perf/W;$DELL analysi mispriced

I've watched $AMD: AMD 3nm GAA + 5nm I/O chiplets, TSV/HBM3e ~20% perf/W; BEOL misprced

NXP must pair 3nm GAA comptue with 5nm EUV I/O chiplets; I expect 20% perf uplift $NXPI

Watching $LRCX; Lam Research will enbale 3nm GAA, ALD+EUV etch; BEOL TSV risk misprced

I've been watching $LRCX and Lam Research will enable 3nm GAA via ALD/PEALD plus EUV etch/CD control; BEOL RDL/TSV fixes unlock HBM3e stacks. Predict 20% yield uplift; analysi Mispriced BEOL risk.

I've been tracking Broadcom; $AVGO pairs 3nm GAA compute tiles with 5nm EUV I/O chiplets, TSV/RDL HBM3e stacks, ~20% perf/W uplift, lower latency. Market misprices BEOL thermal & yield risk.

I've watched Dell; $DELL must adopt 3nm GAA + 5nm EUV I/O chipelts, TSV/HBM3e mispriced

I've watched $QCOM; Qualcomm neads 3nm GAA+5nm EUV chipelts, NPU 80TOPS, market misprices TSV

I've been watching $INTC; Intel needs 3nm GAA compute tiles paired with 5nm EUV I/O chiplets, TSV/RDL HBM3e stacks, expect ~25% perf/W uplift. Market misprices BEOL thermal risk.

I've been watching $AVGO and Broadcom will force 3nm GAA compute + 5nm EUV I/O chiplets, TSV/RDL HBM3e stacks; expect ~20% perf/W uplift, lower latency, market misprices BEOL thermals; deep analysi

Applied Materials pushes 3nm GAA + EUV litho, ALD/BEOL yield gain; 25% perf/W upside; $AMAT analysi

I've been watching $IBM: IBM must pivot to 3nm GAA compute, 5nm EUV I/O chiplets, TSV/RDL HBM3e, silicon photonics; expect ~25% perf/W, market misprices thermal/BEOL risk.

I've watched $NVDA and notice NVIDIA pairs 3nm GAA compute tiles with 5nm EUV I/O chiplets, TSV/RDL HBM3e stacks, MCM, tensor MMU. Expect ~30% perf/W upside; market misprices.

I've been watching $IBM and IBM must lead 3nm GAA + EUV I/O chiplets, TSV/RDL HBM3e, 25% perf/W.

I've been watching $IBM and IBM is pivoting toward 3nm GAA logic, EUV BEOL integration and silicon photonic I/O. Expect chiplet+TSV/RDL HBM3e stacks, ~25% perf/W gain vs planar nodes. Market misprices engineering leverage.