Power Electronics News

Pulsiv Launches Innovative 65- to 70-W USB-C Power Modules These fully assembled power modules address key challenges in heat management, form factor constraints, and safety.

Pulsiv Launches Innovative 65- to 70-W #USBC #PowerModules #powerelectronics

Using Renewable Energy to Produce Future Green Hydrogen Green hydrogen can decarbonize diverse sectors by providing fuel, heat, power systems, and energy storage services.

Green #hydrogen can decarbonize diverse sectors by providing fuel, heat, power systems, and energy storage services. #renewableenergy

IGBTs For Induction Heaters IGBTs combine the benefits of a voltage-driven insulated gate of MOSFETs with the improved bipolar conduction of BJTs.

IGBTs combine the benefits of a voltage-driven insulated gate of #MOSFETs with the improved bipolar conduction of BJTs. #IGBTs #InductionHeating

Agnit Semiconductors Sparks India’s GaN Breakthrough Agnit Semiconductors is working to establish India’s self-reliance in Gallium Nitride (GaN) technology.

Agnit Semiconductors Sparks India’s #GaN Breakthrough #verticalGaN #semiconductor

Wine Down Friday with Circuit Integrated Hellas’s Paolo Fioravanti Paolo Fioravanti, CEO and co-founder of Circuit Integrated Hellas.

Paolo Fioravanti, CEO and co-founder of Circuit Integrated Hellas, to talk about his journey from robotics and control systems to leading innovations in millimeter-wave and RF IC technology. #WDF #winedownfriday

Shifting the Innovation Focus in Power Semiconductors Innovation in power electronics is shifting from a focus on semiconductor materials to a broader system-level engineering approach.

Innovation in #powerelectronics is shifting from a focus on #semiconductor materials to a broader system-level #engineering approach.

Indium Corporation Launches WS-910 Water-Soluble Flip-Chip Flux for Next-Gen Semiconductor Packaging This flip-chip flux product line is specifically engineered to tackle key miniaturization challenges, such as handling thin or warped substrates and enabling precise assembly in fine-pitch, high I/O count applications.

Indium Corporation Launches WS-910 Water-Soluble #FlipChipFlux for Next-Gen #Semiconductor #Packaging

Reliability Challenges and Models for SiC and GaN Power Devices Tsuriel Avraham and his colleagues from Ariel University reviewed reliability challenges and models for SiC and GaN power devices.

Tsuriel Avraham and his colleagues from Ariel University reviewed reliability challenges and models for #SiC and #GaN power devices.

Enhancing SiC Power Module Reliability Through Liquid-Metal Packaging Integrating liquid-metal packaging into a SiC half-bridge power module is an innovative solution to longstanding challenges.

Integrating liquid-metal packaging into a #SiC half-bridge #PowerModule is an innovative solution to longstanding challenges. #LiquidMetal

Diodes Incorporated Unveils Quad-Channel Hybrid ReDrivers to Boost HDMI Signal Integrity and Simplify System Design The hybrid ReDrivers serve as a bridge between the signal source—such as a CPU or GPU—and the destination device, like a display, by correcting signal degradation that occurs during transmission over extended lines.

Diodes Incorporated Unveils #QuadChannel Hybrid #ReDrivers to Boost #HDMI #SignalIntegrity and Simplify System Design

Innoscience and NVIDIA Partner to Accelerate Adoption of 800V Power Architecture in Next-Gen AI Data Centers NVIDIA’s 800 VDC architecture represents the next generation of power systems, purpose-built to deliver efficient and reliable energy for the megawatt-scale computing infrastructure of the future.

Innoscience and NVIDIA Partner to Accelerate Adoption of #800V #PowerArchitecture in Next-Gen #AI #DataCenters

EPC and Infineon Secure Legal Victories Against Innoscience, Reinforcing Global GaN Patent Protection These decisions across multiple jurisdictions reinforce the importance of strong patent protections in the rapidly evolving GaN semiconductor industry.

EPC and Infineon Secure Legal Victories Against Innoscience, Reinforcing Global #GaN #PatentProtection #IP

The Automotive Evolution: From Origin to EVs At over 100 years old, the automotive industry now faces the challenge of transitioning to sustainable and electric modes of transportation.

The Automotive Evolution: From Origin to EVs

At over 100 years old, the automotive industry now faces the challenge of transitioning to sustainable and electric modes of transportation.

Cybersecurity Vulnerabilities in Grid-Connected Smart Inverters: A Technical Analysis of DoS Threats The rapid adoption of grid-connected smart inverters involves vulnerabilities that could compromise the stability, reliability, and security of power grids.

The rapid adoption of grid-connected smart #inverters involves vulnerabilities that could compromise the stability, reliability, and security of #powergrids. #DoS

Enabling the 800VDC Revolution: onsemi and NVIDIA Collaborate to Power the Future of AI Data Centers Initiative lays the groundwork for high-voltage architectures, enabling unprecedented gains in efficiency and power density.

Enabling the #800V DC Revolution: onsemi and NVIDIA Collaborate to Power the Future of #AI #DataCenters

Xiaomi Taps Navitas’ GaNSense Control ICs for Ultra-Compact 90W GaN Charger The GaNSense Control family integrates fourth-generation GaN power technology with advanced high-frequency control capabilities.

Xiaomi Taps Navitas’ #GaNSense #ControlICs for Ultra-Compact 90W #GaNCharger

PEN eBook July/August, Dynamic Z-Track Technology, Battery Swapping: Power Electronics Week Insights Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on PEN eBook July/August, Dynamic Z-Track Technology, and Battery Swapping!

#PENeBook July/August, #DynamicZTrack #Technology, #BatterySwapping: #PowerElectronics Week Insights

The Rise of Dense Vertical Integration: GaN Vias Drive Scalable 3D Electronics A key enabler of true 3D heterogeneous integration is through-GaN strata vias: a breakthrough technology that vertically connects GaN layers to underlying silicon (Si) substrates.

The Rise of Dense #VerticalIntegration: #GaN #Vias Drive Scalable #3DElectronics

Onsemi Fuels SiC Breakthroughs With Strategic University Partnership Onsemi is investing $8 million to establish a WBG semiconductor research center in New York, led by SiC experts at Stony Brook University.

Onsemi is investing $8 million to establish a WBG #semiconductor research center in New York, led by #SiC experts at Stony Brook University. #onsemi

#WideBandgap Monthly Insights – July 2025 #WBG #SiC #GaN #powerelectronics

Pioneering 800V HVDC Power Distribution for Next-Generation AI Data Centers Texas Instruments and NVIDIA have partnered to develop 800V HVDC power distribution systems aimed at powering the next generation of AI data centers.

Pioneering #800V #HVDC #PowerDistribution for Next-Generation #AI #DataCenters

Next-Gen Power Architectures in Solar Power: GaN and Bidirectionality Enable Single-Stage Topologies in Microinverters (Podcast) Renesas’s single-stage, bidirectional GaN-based microinverter could redefine the future of energy conversion and distributed power systems.

Renesas’s single-stage, bidirectional GaN-based microinverter could redefine the future of energy conversion and distributed power systems. #GaN #Renesas #PowerUP

Innoscience and UAES Launch Joint Lab to Advance GaN-Based Power Electronics for Next-Generation EVs Innoscience will leverage UAES’s extensive system expertise to enhance GaN technology and drive the development of next-generation power electronics systems for new energy vehicles.

Innoscience and UAES Launch Joint Lab to Advance #GaN Based #PowerElectronics for Next-Generation #EVs

ABB and Formula E Extend Partnership to Accelerate Global Electrification and Innovation ABB and Formula E will continue their collaboration, allowing ABB to further strengthen its brand identity and tagline: “Engineered to Outrun".

ABB and #FormulaE Extend Partnership to Accelerate Global #Electrification and Innovation #automotive

GaN Power Electronics: Why Vanguard Is Shifting to High Gears While TSMC Recalibrates Insights from an Exclusive Interview with Cem Basceri, CEO of Qromis.

Insights from an Exclusive Interview with Cem Basceri, CEO of Qromis. #GaN #TSMC #VIS #manufacturing

PEN eBook July/August 2025 – Innovations in Power Electronics: Driving Sustainable Energy Solutions In this issue of our eBook, we delve into the core of power electronics innovation and how design is evolving.

In this issue of our #eBook, we delve into the core of #PowerElectronics innovation and how design is evolving. #pen #ebook #powerelectronics

Infineon Expands Power Efficiency Frontiers with CoolSiC™ 1200 V G2 MOSFETs in Top-Side-Cooled Q-DPAK Package The CoolSiC 1200 V G2 MOSFETs are offered in two Q-DPAK configuration options: a single-switch variant and a dual half-bridge version.

Infineon Expands Power Efficiency Frontiers with #CoolSiC 1200 V G2 #MOSFETs in #TopSideCooled #QDPAK Package

TDK Enhances Automotive Power-over-Coax Solutions with Advanced Wire-Wound Inductors for Efficient High-Frequency Signal Handling The inductors deliver high impedance performance across an extended frequency range exceeding 1 GHz.

TDK Enhances #Automotive Power-over-Coax Solutions with Advanced Wire-Wound #Inductors for Efficient High-Frequency #SignalHandling

Texas Instruments Debuts Industry-First Adaptive Fuel Gauges for Smarter Battery Management “The key innovation here is a transient-capable battery model,” said Yevgen Barsukov, Fellow at TI and Head of BMS Algorithm Development, in an interview with Power Electronics News.

Texas Instruments (TI) has released a new generation of single-chip battery fuel gauges that use its revolutionary adaptive Dynamic Z-Track technology. #TI #battery

Onsemi CEO Hassane El-Khoury is urging a fundamental rethink in how energy is managed to support AI’s growth. #AI #onsemi #semiconductors