He tried on Leavitts necklace.

Leukemia?

Would be cool to strip that entire abomination of a building and leave it that way. Then board up all exits and put this treasonous scumbag in it. Then forget about it.

Are these the payed protestors president Dumb was referring to all the time?

You don't have to guess or search for reasons. It's obvious from the name of the Operation.

Epstein Fury.

Hungary’s EU funding mainly comes via cohesion funds (regional development/infrastructure) and CAP farm subsidies, plus €5.8bn RRF grants (post-COVID reforms).

Since 2004, EU net transfers averaged ~2% of GDP/yr; 2021–27 cohesion allocation ~€20.7bn.

Take that away please.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030 — new 1,000-watt light source fires three lasers at 100,000 tin droplets every second Technology breakthroughs involved.

15/15

www.tomshardware.com/tech-industr...

14/15 The breakthrough strengthens ASML’s roadmap and reinforces Europe’s structural importance in the chip stack. It doesn’t “lock in permanent leverage,” but it raises the cost of decoupling and delays. In a tariff-heavy world, that’s bargaining power Europe can use.

13/15 Key nuance: 1,000W was shown in the lab. Turning it into high-volume manufacturing means reliability, service intervals, contamination control, and availability. A 330 WPH tool that’s down more often may lose to a slower but ultra-stable workhorse in net wafers.

12/15 Can the US replicate EUV quickly? Unlikely. EUV took decades, massive R&D, and deep optics and mechatronics know-how. Even with funding, building a rival supply chain and field reliability is a 10+ year marathon. That’s why dependency likely persists through the 2020s.

11/15 High-NA EUV (EXE series) is a cornerstone for future leading nodes, and Intel/TSMC/Samsung are lining up. These tools are massive, scarce, and expensive. So access, install speed, service talent, and process integration become competitive moats. Scarcity becomes strategy.

10/15 “50% more chips by 2030” is per-machine throughput potential, not guaranteed global output. Fabs face other bottlenecks: masks, resists, pellicles, metrology, yield learning, power/water, advanced packaging, and skilled labor. Semiconductors are multi-constraint systems.

9/15 The US wants more domestic chipmaking (CHIPS logic), yet leading-edge production still relies on imported EUV tools. A single delayed tool shipment, retrofit, or slower field upgrade can slip a fab ramp by months. Time is everything in AI chips. Delays mean lost market share.

Supreme Court strikes down tariffs Updated on Feb. 20 at 4:21 p.m. In a major ruling on presidential power, the Supreme Court on Friday struck down the sweeping tariffs that President Donald Trump imposed in […]

8/15 On Feb 20, 2026 the US Supreme Court limited emergency-powers tariffs; policy then pivoted to new duties and talk of 15% rates.

scotusblog.com/2026/02/supreme-court-strikes-down-tariffs/

7/15 Dependency isn’t a magic on/off switch. Export controls already exist and are negotiated. But ASML’s position does give Europe leverage in trade disputes, because there’s no alternative EUV supplier at scale today. That’s the real leverage.

6/15 Only Europe has this tech. But it’s not just ASML. Zeiss supplies key optics and hundreds of specialists feed subsystems. The monopoly is embedded in an ecosystem, not a single patent or factory floor. And the know-how is tacit.

5/15 The “100,000 droplets/second” detail shows the scaling pain. Droplet shaping, plasma efficiency, debris mitigation, optics lifetime, and uptime all trade off. Crank brightness too fast and you can shorten mirror/pellicle life or raise downtime, hurting net output.

4/15 How EUV works (simplified): fire tin droplets in vacuum, hit them with lasers to create plasma, emit 13.5nm EUV light, then bounce it through ultra-precise mirrors to print patterns onto silicon. Tiny tolerances and brutal uptime demands requires extreme engineering. And it must run nonstop.

3/15 EUV scanners are often source-brightness limited. More EUV photons means shorter exposures and more wafers/hour. That cuts cost per wafer and compounds when fabs run 24/7 with many tools, tight cycle-time targets, and scarce cleanroom space. Physics sets the pace.

ASML: euv-machines kunnen 50 procent sneller chips printen door 1000W-lichtbron ASML wil vanaf 2030 de verwerking van wafers in zijn euv-machines met de helft verhogen. Dat is mogelijk dankzij een boost van de hoeveelheid licht die ontstaat om transistors op siliciumwafers te 'pr...

2/15
ASML hit a lab milestone. EUV source power from ~600W to 1,000W. If industrialized, throughput could rise from 220 wafers/hour to 330 WPH by 2030, +50% output per tool without expanding fab floor space.

Details: tweakers.net/nieuws/245000

1/15
Europe doesn’t control America’s tech future, but ASML is a real choke point. It’s the only supplier of EUV lithography tools for the most advanced chips. That dependency makes EUV strategic infrastructure, not just machinery, because no EUV equals no leading-edge nodes.

Fortunate Son

*objections*
There were very strong objections. Not objectives you ape.

I hope they have Slovenian translators on hand. Milanija is very hard to understand.

That's just the way it ihihis. Some guys will never change.

www.senate.gov/about/powers...

www.nato.int/en/about-us/...

United Nations Charter (full text) | United Nations

www.un.org/en/about-us/...

www.oyez.org/cases/1981/8...

constitution.congress.gov/browse/artic...