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Semiconductor Engineering

@semiengineering.bsky.social

Deep insights for the chip industry. semiengineering.com Hot topics: semiconductor, EDA, advanced packaging, hardware, low power, HPC, hardware security, automotive chips, embedded, edge computing, semiconductor manufacturing, chip design, VLSI

1,343 Followers  |  1,045 Following  |  374 Posts  |  Joined: 15.11.2024  |  1.8151

Latest posts by semiengineering.bsky.social on Bluesky

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Resistance In Advanced Packages Is Now A System-Level Problem Multi-die assemblies require the measurement of subtle changes at the precise point where they occur.

Kelvin measurement, which has been in use for decades, is no longer sufficient for addressing resistance in complex chips.
semiengineering.com/resistance-i...

#semiconductor

10.02.2026 16:35 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Consumer, Med Tech Mushrooms As Quantum Closes In Bio-inspired medical devices can gather more data than ever before, and HPC/quantum will massively speed up discovery rates; consumer self-testing will be slower.

Major developments are occurring in the bio-medical space, where new types of devices made of unusual materials & gels can measure tiny lab-grown brain cells, & sensors can measure every environmental & bodily function, from blood to heart & everything in between
semiengineering.com/bio-neuro-de...

09.02.2026 16:16 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Semiconductor Engineering's latest Test, Measurement and Analytics newsletter
semiengineering.com/newsletter/t...

#semiconductor

08.02.2026 16:38 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week in Review Intel's GPU push; strong M&A; Lam-CEA deal; AI workload fundings; Z-Angle memory; TSMC 3nm in Japan; improving chip power delivery; Arm's expanded startup program; sleeper agent-style backdoors; VR fo...

Weekly news roundup for the chip industry semiengineering.com/chip-industr...

#semiconductor

06.02.2026 16:32 β€” πŸ‘ 2    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Securing Hardware For The Quantum Era Quantum computers may become a security threat as early as next year, and that threat will continue to grow over the next several years.

Quantum computers may become a security threat as early as next year, and that threat will continue to grow over the next several years.
semiengineering.com/securing-har...

05.02.2026 16:24 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Why Move To 2nm? Leading-edge chipmakers are starting to look at process node scaling very differently.

Power, performance, and area/cost are still the key metrics for chipmakers, yet how those metrics are weighted and implemented can vary significantly.
semiengineering.com/why-move-to-...
#2nm #semiconductor

04.02.2026 17:06 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Multi-Die Assemblies Require More Detailed Test Plan Earlier Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other areas.

Multi-die assemblies are forcing engineering teams to map out how the various components will function and interact much earlier in the design process, and to develop a detailed plan for how they will be verified and tested. semiengineering.com/multi-die-as...
#semiconductor

03.02.2026 16:57 β€” πŸ‘ 2    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Chiplet Fundamentals For Engineers: eBook A 65-page in-depth research report on the next phase of device scaling.

Ebook: Chiplet Fundamentals For Engineers: no charge
semiengineering.com/chiplet-fund...

#semiconductor #chiplets

02.02.2026 16:48 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week In Review New joint venture for high-speed interconnects; 2nm Indian chips; NAND capacity boost; quantum accelerates; CPO deals; U.S. rare earths deal; new AI chip; earnings bonanza; new test/package plant; fre...

Latest news in the chip industry semiengineering.com/chip-industr...

#semiconductor

30.01.2026 16:23 β€” πŸ‘ 1    πŸ” 2    πŸ’¬ 0    πŸ“Œ 0
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Does Your RISC-V Core Meet The Standard? Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.

Multiple disciplines are associated with verification, each important and each becoming increasingly complex. RISC-V adds another one β€” architectural conformance β€” which until recently has been tackled behind closed doors by just a few companies.

semiengineering.com/does-your-ri...
#RISCV

31.01.2026 23:31 β€” πŸ‘ 1    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week In Review New joint venture for high-speed interconnects; 2nm Indian chips; NAND capacity boost; quantum accelerates; CPO deals; U.S. rare earths deal; new AI chip; earnings bonanza; new test/package plant; fre...

Latest news in the chip industry semiengineering.com/chip-industr...

#semiconductor

30.01.2026 16:23 β€” πŸ‘ 1    πŸ” 2    πŸ’¬ 0    πŸ“Œ 0
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Special Report:
AI’s Impact On Engineering Jobs May Be Different Than Expected:
Workflows & the addition of new capabilities are happening much faster than with previous technologies, & new grads may be vital in that transition
semiengineering.com/ais-impact-o...
#semiconductor #EDA #AgenticAI

29.01.2026 16:33 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Latest Semiconductor Engineering newsletter:
Manufacturing, Packaging and Materials semiengineering.com/newsletter/m...

#semiconductor #semiconductormanufacturing

28.01.2026 16:38 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Balancing Training, Quantization, And Hardware Integration In NPUs Evolving challenges and strategies in AI/ML model deployment and hardware optimization have a big impact on NPU architectures.

Final in 3-part NPU series
semiengineering.com/balancing-tr...

#NPUs

27.01.2026 16:17 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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An Explosion In Interconnect Complexity The chip industry has gone from two routing platforms to five. That's a lot.

For decades, electronics offered 2 levels of routing structure to manage signals that originate or terminate in an IC. Recently, that number has risen to 5, bringing greater complexity and design decisions
semiengineering.com/an-explosion...

#interconnects #semiconductor

26.01.2026 16:38 β€” πŸ‘ 3    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week In Review TSMC mature node capacity reduction; Photonics West highlights; Intel earnings; tariffs on memory makers; big fundings; Davos takeaways; ultrafast data transmission; DARPA's IC heat program; new wafer...

Latest news in the chip industry semiengineering.com/chip-industr...
#semiconductor

23.01.2026 15:06 β€” πŸ‘ 1    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Oxides Bring Low Leakage Transistors To Leading-Edge Memories New approaches and research surge in the face of DRAM shortages and SRAM scaling limitations.

New approaches and research surge in the face of DRAM shortages and SRAM scaling limitations.
semiengineering.com/oxides-bring...

24.01.2026 18:19 β€” πŸ‘ 4    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week In Review TSMC mature node capacity reduction; Photonics West highlights; Intel earnings; tariffs on memory makers; big fundings; Davos takeaways; ultrafast data transmission; DARPA's IC heat program; new wafer...

Latest news in the chip industry semiengineering.com/chip-industr...
#semiconductor

23.01.2026 15:06 β€” πŸ‘ 1    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Every Atom Now Counts In Advanced Chip Manufacturing How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.

Semiconductor progress often is described as a story of shrinking transistors. Increasingly, it is becoming a story of the materials between them.
semiengineering.com/every-atom-n...

#semiconductor

22.01.2026 16:25 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Big Changes Ahead For Semiconductor Manufacturing Inside Chips Podcast: PDF Solutions' CEO discusses AI in chip manufacturing, 3D-ICs, and shorter cycle times.

John Kibarian, CEO of PDF Solutions, talks with SE’s Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.
semiengineering.com/big-changes-...

21.01.2026 16:30 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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HBM4 Sticks With Microbumps, Postponing Hybrid Bonding Process cost and yield issues delay the adoption of hybrid bonding.

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding
semiengineering.com/hbm4-sticks-...
#HBM4

20.01.2026 17:06 β€” πŸ‘ 2    πŸ” 2    πŸ’¬ 0    πŸ“Œ 0
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Startup Funding: Q4 2025 More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise $3 billion.

Always an interesting quarterly report to peruse. Here's where the investments are going. Don't miss the chart at the end semiengineering.com/startup-fund...

#semiconductor

19.01.2026 16:40 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week in Review Micron's new Taiwan fab; goal to bring 40% of Taiwan's chip supply to the U.S.; 25% tariff on AI chip imports to U.S.; SK hynix buildout; 2 acquisitions; LPDDR5X for data centers; Wolfspeed's mileston...

semiengineering.com/chip-industr...

18.01.2026 23:31 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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How And Why To Optimize NPUs PPA constraints need to be paired with real workloads, but they also need to be flexible to account for future changes.

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.
6 experts discuss how and why to optimize NPUs.
semiengineering.com/how-and-why-...

#NPU

18.01.2026 17:41 β€” πŸ‘ 2    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Chip Industry Week in Review Goal to bring 40% of Taiwan's chip supply to the U.S.; 25% tariff on AI chip imports to U.S.; SK hynix buildout; 2 acquisitions; LPDDR5X for data centers; Wolfspeed's milestone; TSMC Q4; Ireland IC ex...

Latest news in the semiconductor industry semiengineering.com/chip-industr...

#semiconductor

16.01.2026 14:50 β€” πŸ‘ 1    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Liquid Cooling Gains Traction In Data Centers There are numerous ways to remove heat from chips, and more are on the way.

With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buildout. Single-phase cooling predominates currently, but 2-phase & immersion cooling are also growing as options.
semiengineering.com/liquid-cooli...
#datacenters #cooling #AI

15.01.2026 17:05 β€” πŸ‘ 2    πŸ” 1    πŸ’¬ 0    πŸ“Œ 0
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Secure Data Sharing Becoming Critical For Chip Manufacturing Driven by a plethora of benefits, data sharing is gradually becoming a β€œmust have” for advanced device nodes and multi-die assemblies.

Data sharing is becoming critical at leading device nodes, where process variability is starting to consume ever-greater portions of the process margin.
semiengineering.com/secure-data-...

#semiconductor

14.01.2026 16:50 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Wafer Probe Struggles To Adapt To Multi-Die Assemblies Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

In today’s AI-class devices, wafer probe has become one of the most mechanically aggressive and least forgiving steps in the entire flow. semiengineering.com/wafer-probe-...

#semiconductor

13.01.2026 16:37 β€” πŸ‘ 1    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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Automotive Outlook: 2026 Tariffs, EV costs and challenges, and fundamental architectural and technology improvements add up to transformative multi-year, multi-market changes.

Automotive Outlook: 2026
semiengineering.com/automotive-o...

#automotive

12.01.2026 16:32 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0
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New technical papers recently added to Semiconductor Engineering’s library:
semiengineering.com/chip-industr...

#semiconductor

11.01.2026 17:06 β€” πŸ‘ 0    πŸ” 0    πŸ’¬ 0    πŸ“Œ 0

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